| No | Items | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| 1 | Materia l | HDI PCB material | IT-180A,S1000-2,TU-768(TU-752),TU-862HF,IT-170GRA1,
S7439C,R-5775G,IT-968,TU-883,IT-988GSE,R-5785N,
Meteorwave4000 | IT-180A,S1000-2,TU-768(TU-752),R-5775G,R-5785N |
| 2 | High CTI | S1151G(Halogen free)) | S1151G(Halogen free)) |
| 3 | PI material | VT-901,VT-90H,85N | VT-901,VT-90H,85N |
| 4 | HighSpeed material | TU-862 HF(Halogen free)),IT-170GRA1(Halogen free),FR408HR
,TU-872 SLK,R-5725S,TU-872 SLK SP,N4103-13,N4103-13 EP, N4103-13 SI,N4103-13 EPSI,N4800-20 SI,S7439C,R-5775G,IT- 968,R-5775N,IT-968 SE,TU-883,R-5775K,R-5785N,
Meteorwave4000,IT-988G SE,TU-933+ | TU-862 HF(Halogen free)),IT-170GRA1(Halogen free)),TU-872 SLK, R-5725S,TU-872 SLK SP,N4103-13,N4103-13 EP,N4103-13 SI,N4103-13 EPSI,R-5775G,IT-968,R-5775N,IT-968 SE,TU-883,R-5785N,
Meteorwave4000,IT-988G SE,TU-933+ |
| 5 | High Frequency CCL material | Aerowave 300,ZYC8300,ZYF3000CA-P,RO4730G3,RO4533,RO4533 Lopro,LNB33,S7136H,HC35,RO4350B,RO4350B Lopro,TLF-35,RF- 35,RF-35TC,RF-45,RF-60TC,TLY-5,RT5880,ZYF220D,DiClad 880
,TLX-8,F4BM-2,RO4725JXR,RO4725JXR lopro,TLX-9,GF255, ZYF265D,TSM-DS3M,RT6002,TSM-DS3,RO4003C,RO4003C Lopro, mmWave77,RO3003,RT6010LM,AD1000,AD1000L,TP-2,TMM10 | Aerowave 300,RO4730G3,RO4533,RO4533 Lopro,S7136H,RO4350B, RO4350B Lopro,RF-35,RF-35TC,RF-45,RF-60TC,TLY-5,RT5880,DiClad 880,TLX-8,RO4725JXR,RO4725JXR lopro,TSM-DS3M,RT6002,RO4003C, RO4003C Lopro,RO3003,RT6010LM |
| 6 | High Frequency PP material | (FR-28-0040-50,FR-25-0021-45,FR-26-0025-60,FR-27-0045-35,
FR-27-0050-40),Aerobond350,Synamic 6B,RO4450F | Synamic 6B,RO4450F |
| 7 | Metal substrate PCB | T110,T111,T1112,T112B,T112C,VT-4A1,VT-4A2,VT-4B3,VT-4B5
,92MCL,1KA04,1KA06,1KA08,VT-4A2,T512, | T110,T111,T1112,T112B,T112C,VT-4A1,VT-4A2,VT-4B3,VT-4B5, 92MCL,1KA04,1KA06,1KA08,VT-4A2,T512, |
| 8 | Metal substrate PCB PP | ST115B,VT-4A2,1KA04,1KA06,1KA08 | ST115B,VT-4A2,1KA04,1KA06,1KA08 |
| 9 | Hybrid laminating | Rogers,Taconic,Arlon,Nelco&fr4,high speed material & FR4, High Frequency material & high speed material | Rogers,Taconic,Arlon,NelcoFR-4,high speed material & FR4,High Frequency material & high speed material |
| 10 | PCB
type | Rigid PCB | Backplane,HDI,High multi-layer blind&buried PCB,Embedded Capacitance,Embedded resistance board ,
Heavy copper power PCB,Backdrill,Semiconductor Test products. | Backplane,HDI,High multi-layer blind&buried PCB,Backdrill&Heavy copper power PCB |
| 11 | Buildin gs | Blind&buried via type | mechanical blind&burried vias with less than 3 times laminating | mechanical blind&burried vias with less than 2 times laminating |
| 12 | HDI | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2((n buried vias≤0.3mm),Laser blind via can be filling plating |
| No | Items | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| 13 | Surface Finish treatme nt | Surface Finish treatment(lead free) | Flash gold(electroplated gold),ENIG,Hard gold,Flash gold, HASL Lead free,OSP,ENEPIG,Soft gold,
Immersion silver,Immersion Tin,ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold
finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | Flash gold(electroplated gold),ENIG,Hard gold,Flash gold,HASL Lead free,OSP,ENEPIG,Soft gold,
Immersion silver,Immersion Tin,ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold
finger,Immersion silver+Gold finger,Immersion Tin+Gold finge |
| 14 | Surface Finish
treatment(leaded) | HASL | HASL |
| 15 | Aspect ratio | 10:1(HASL/Lead free HASL,ENIG,Immersion silver,Immersion
Tin,ENEPIG);8:1(OSP) | 10:1(HASL/Lead free HASL,ENIG,Immersion silver,Immersion Tin,
ENEPIG);8:1(OSP) |
| 16 | Max finished size | HASL/Lead free HASL 22"*24";gold finger 24"*24";hard gold
24"*32";ENIG 21"*27";FLASH GOLD21"*48";Immersion tin 16"*21";immersion silver:width max 24",length no limited;
OSP 610*720mm; | HASL/Lead free HASL22"*24";gold finger 24"*24";hard gold 24"*32"; ENIG 21"*27";FLASH GOLD21"*48";Immersion tin 16"*21";immersion silver:width max 24",length no limited;OSP 610*720mm; |
| 17 | MIN finished size | HASL 5"*6";Lead free HASL 6"*10";gold finger 12"*16";hard gold 3"*3";FLASH GOLD 8"*10";Immersion tin/silver 2"*4"; OSP2"*2"; | HASL 5"*6";Lead free HASL 6"*10";gold finger 12"*16";hard gold 3"*3";FLASH GOLD 8"*10";Immersion tin/silver 2"*4";OSP2"*2"; |
| 18 | PCB thickness | HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard
gold 0.1-8.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm; Immersion tin 0.4-5.0mm;immersion silver 0.2-4.0mm;OSP 0.2-
6.0mm; | HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard gold 0.1- 5.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm;Immersion tin 0.4- 5.0mm;immersion silver 0.2-4.0mm;OSP 0.2-6.0mm; |
| 19 | MAX high to gold finger | 1.5inch | 1.5inch |
| 20 | Min space between gold fingers | 5mil | 5mil |
| 21 | Min block space to gold fingers | 5mil | 5mil |
| 22 | Plating
/coatin g thickne ss | HASL | 2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on
large tin area of HASL lead free) | 2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin
area of HASL lead free) |
| 23 | OSP | osp thickness:0.2-0.6μm | osp thickness:0.2-0.6μm |
| 24 | ENIG | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm |
| 25 | Immersion silver | silver thickness :0.15-0.4μm | silver thickness :0.15-0.4μm |
| 26 | Immersion tin | tin thickness :≥1.0 | tin thickness :≥1.0 |
| 27 | Hard gold | gold thickness :0.10-1.5μm(Dry film diagram plating
process),gold thickness :0.10-4.0μm(no Dry film diagram
plating process) | gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) |
| 28 | Soft gold | gold thickness :0.10-1.5μm(Dry film diagram plating
process),gold thickness :0.10-4.0μm(no Dry film diagram
plating process) | gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) |
| 29 | ENEPIG | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm;
pd thickness:0.05-0.15μm(welding)
pd thickness:0.075-0.20μm(Gold wire bond)
pd thickness:≥0.3μm(special function) | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm;
pd thickness:0.05-0.15μm(welding)
pd thickness:0.075-0.20μm(Gold wire bond)
pd thickness:≥0.3μm(special function) |
| 30 | Flash Gold | gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass
copper max thickness 1OZ | gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass copper
max thickness 1OZ |
| No | | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| 31 | Gold finger | gold thickness :0.25-1.5μm,Nickelthickness :≥3μm | gold thickness :0.25-1.5μm,Nickelthickness :≥3μm |
| 32 | Carbon | 10-50μm | 10-50μm |
| 33 | Soldermask | on copper area(10-18μm),on via pad(5-8μm),on circuits
around the corner, ≥5μm ,just for one-time print & copper
thickness need lower than 48um | on copper area(10-18μm),on via pad(5-8μm),on circuits around
the corner, ≥5μm ,just for one-time print & copper thickness need
lower than 48um |
| 34 | Blue plastic | 0.20-0.80mm | 0.2-0.4mm |
| 35 | Hole | 0.1/0.15/0.2mm MAX thickness of mechanical hole | 0.8mm/1.6mm/2.5mm | 0.6mm/1.2mm/1.6mm |
| 36 | Min laser drilling size | 0.1mm | 0.1mm |
| 37 | Max laser drilling size | 0.15mm | 0.15mm |
| 38 | Finshed mechanical hole size | 0.10-6.2mm(corresponding drilling tool size0.15-6.3mm) | 0.15-6.2mm(corresponding drilling tool size0.2-6.3mm) |
| 39 | A,Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) | A,Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) |
| 40 | B,Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) | B,Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) |
| 41 | C,Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil | C,Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil |
| 42 | D,Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) | D,Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) |
| 43 | E,Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) | E,Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) |
| 44 | MAX aspect ratio for Hole plate | 20:1(hole diameter>8mil) | 15:1 |
| 45 | Max aspect ratio for laser via filling plating | 1:1 | 0.9:1 |
| 46 | Max aspect ratio for mechanical depth-control
drilling board(Blind hole drilling
depth/blind hole size) | 1.3:1(hole diameter≤0.20mm),1.15:1(hole diameter≥0.25mm) | 0.8:1,hole diameter≥0.25mm |
| 47 | Min. depth of Mechanical depthcontrol(backdrill) | 0.2mm | 0.2mm |
| 48 | Min gap between hole wall and conductor (None blind and buried via PCB) | PIN-LAM:3.5mil(≤4L),4mil(5-8L),4.5mil(9-12L);5mil
(13-16L),6mil(≥17L) | 7mil(≤8L),9mil(10-14),10mil(>14L) |
| 49 | Min gap between hole wall conductor
(Blind and buried via PCB) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) |
| No | | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| 50 | Min gab between hole wall
conductor
(Laser blind hole buried via
PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) |
| 51 | Min space between laser holes
and
conductor | 5mil | 6mil |
| 52 | Min space bwteen hole walls in
different
net | 10mil | 10mil |
| 53 | Min space bwteen hole walls in
the same
net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) |
| 54 | Min space bwteen NPTH hole walls | 8mil | 8mil |
| 55 | Hole location tolerance | ±2mil | ±2mil |
| 56 | NPTH tolerance | ±2mil | ±2mil |
| 57 | Pressfit holes tolerance | ±2mil | ±2mil |
| 58 | Countersink depth tolerance | ±0.15mm | ±0.15mm |
| 59 | Countersink hole size tolerance | ±0.15mm |
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