| Items | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| Materia l | HDI PCB material | IT-180A,S1000-2,TU-768(TU-752),TU-862HF,IT-170GRA1,
S7439C,R-5775G,IT-968,TU-883,IT-988GSE,R-5785N,
Meteorwave4000 | IT-180A,S1000-2,TU-768(TU-752),R-5775G,R-5785N |
| High CTI | S1151G(Halogen free)) | S1151G(Halogen free)) |
| PI material | VT-901,VT-90H,85N | VT-901,VT-90H,85N |
| HighSpeed material | TU-862 HF(Halogen free)),IT-170GRA1(Halogen free),FR408HR
,TU-872 SLK,R-5725S,TU-872 SLK SP,N4103-13,N4103-13 EP, N4103-13 SI,N4103-13 EPSI,N4800-20 SI,S7439C,R-5775G,IT- 968,R-5775N,IT-968 SE,TU-883,R-5775K,R-5785N,
Meteorwave4000,IT-988G SE,TU-933+ | TU-862 HF(Halogen free)),IT-170GRA1(Halogen free)),TU-872 SLK, R-5725S,TU-872 SLK SP,N4103-13,N4103-13 EP,N4103-13 SI,N4103-13 EPSI,R-5775G,IT-968,R-5775N,IT-968 SE,TU-883,R-5785N,
Meteorwave4000,IT-988G SE,TU-933+ |
| High Frequency CCL material | Aerowave 300,ZYC8300,ZYF3000CA-P,RO4730G3,RO4533,RO4533 Lopro,LNB33,S7136H,HC35,RO4350B,RO4350B Lopro,TLF-35,RF- 35,RF-35TC,RF-45,RF-60TC,TLY-5,RT5880,ZYF220D,DiClad 880
,TLX-8,F4BM-2,RO4725JXR,RO4725JXR lopro,TLX-9,GF255, ZYF265D,TSM-DS3M,RT6002,TSM-DS3,RO4003C,RO4003C Lopro, mmWave77,RO3003,RT6010LM,AD1000,AD1000L,TP-2,TMM10 | Aerowave 300,RO4730G3,RO4533,RO4533 Lopro,S7136H,RO4350B, RO4350B Lopro,RF-35,RF-35TC,RF-45,RF-60TC,TLY-5,RT5880,DiClad 880,TLX-8,RO4725JXR,RO4725JXR lopro,TSM-DS3M,RT6002,RO4003C, RO4003C Lopro,RO3003,RT6010LM |
| High Frequency PP material | (FR-28-0040-50,FR-25-0021-45,FR-26-0025-60,FR-27-0045-35,
FR-27-0050-40),Aerobond350,Synamic 6B,RO4450F | Synamic 6B,RO4450F |
| Metal substrate PCB | T110,T111,T1112,T112B,T112C,VT-4A1,VT-4A2,VT-4B3,VT-4B5
,92MCL,1KA04,1KA06,1KA08,VT-4A2,T512, | T110,T111,T1112,T112B,T112C,VT-4A1,VT-4A2,VT-4B3,VT-4B5, 92MCL,1KA04,1KA06,1KA08,VT-4A2,T512, |
| Metal substrate PCB PP | ST115B,VT-4A2,1KA04,1KA06,1KA08 | ST115B,VT-4A2,1KA04,1KA06,1KA08 |
| Hybrid laminating | Rogers,Taconic,Arlon,Nelco&fr4,high speed material & FR4, High Frequency material & high speed material | Rogers,Taconic,Arlon,Nelco,FR-4,high speed material & FR4,High Frequency material & high speed material |
PCB
type | Rigid PCB | Backplane,HDI,High multi-layer blind&buried PCB,Embedded Capacitance,Embedded resistance board ,
Heavy copper power PCB,Backdrill,Semiconductor Test products. | Backplane,HDI,High multi-layer blind&buried PCB,Backdrill&Heavy copper power PCB |
| Buildin gs | Blind&buried via type | mechanical blind&burried vias with less than 3 times laminating | mechanical blind&burried vias with less than 2 times laminating |
| HDI | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2((n buried vias≤0.3mm),Laser blind via can be filling plating |
| Items | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| Surface Finish treatme nt | Surface Finish treatment(lead free) | Flash gold(electroplated gold),ENIG,Hard gold,Flash gold, HASL Lead free,OSP,ENEPIG,Soft gold,
Immersion silver,Immersion Tin,ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold
finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | Flash gold(electroplated gold),ENIG,Hard gold,Flash gold,HASL Lead free,OSP,ENEPIG,Soft gold,
Immersion silver,Immersion Tin,ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold
finger,Immersion silver+Gold finger,Immersion Tin+Gold finge |
Surface Finish
treatment(leaded) | HASL | HASL |
| Aspect ratio | 10:1(HASL/Lead free HASL,ENIG,Immersion silver,Immersion
Tin,ENEPIG);8:1(OSP) | 10:1(HASL/Lead free HASL,ENIG,Immersion silver,Immersion Tin,
ENEPIG);8:1(OSP) |
| Max finished size | HASL/Lead free HASL 22"*24";gold finger 24"*24";hard gold
24"*32";ENIG 21"*27";FLASH GOLD21"*48";Immersion tin 16"*21";immersion silver:width max 24",length no limited;
OSP 610*720mm; | HASL/Lead free HASL22"*24";gold finger 24"*24";hard gold 24"*32"; ENIG 21"*27";FLASH GOLD21"*48";Immersion tin 16"*21";immersion silver:width max 24",length no limited;OSP 610*720mm; |
| MIN finished size | HASL 5"*6";Lead free HASL 6"*10";gold finger 12"*16";hard gold 3"*3";FLASH GOLD 8"*10";Immersion tin/silver 2"*4"; OSP2"*2"; | HASL 5"*6";Lead free HASL 6"*10";gold finger 12"*16";hard gold 3"*3";FLASH GOLD 8"*10";Immersion tin/silver 2"*4";OSP2"*2"; |
| PCB thickness | HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard
gold 0.1-8.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm; Immersion tin 0.4-5.0mm;immersion silver 0.2-4.0mm;OSP 0.2-
6.0mm; | HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard gold 0.1- 5.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm;Immersion tin 0.4- 5.0mm;immersion silver 0.2-4.0mm;OSP 0.2-6.0mm; |
| MAX high to gold finger | 1.5inch | 1.5inch |
| Min space between gold fingers | 5mil | 5mil |
| Min block space to gold fingers | 5mil | 5mil |
Plating
/coatin g thickne ss | HASL | 2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on
large tin area of HASL lead free) | 2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin
area of HASL lead free) |
| OSP | osp thickness:0.2-0.6μm | osp thickness:0.2-0.6μm |
| ENIG | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm |
| Immersion silver | silver thickness :0.15-0.4μm | silver thickness :0.15-0.4μm |
| Immersion tin | tin thickness :≥1.0 | tin thickness :≥1.0 |
| Hard gold | gold thickness :0.10-1.5μm(Dry film diagram plating
process),gold thickness :0.10-4.0μm(no Dry film diagram
plating process) | gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) |
| Soft gold | gold thickness :0.10-1.5μm(Dry film diagram plating
process),gold thickness :0.10-4.0μm(no Dry film diagram
plating process) | gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) |
| ENEPIG | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm;
pd thickness:0.05-0.15μm(welding)
pd thickness:0.075-0.20μm(Gold wire bond)
pd thickness:≥0.3μm(special function) | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm;
pd thickness:0.05-0.15μm(welding)
pd thickness:0.075-0.20μm(Gold wire bond)
pd thickness:≥0.3μm(special function) |
| Flash Gold | gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass
copper max thickness 1OZ | gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass copper
max thickness 1OZ |
| | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| Gold finger | gold thickness :0.25-1.5μm,Nickelthickness :≥3μm | gold thickness :0.25-1.5μm,Nickelthickness :≥3μm |
| Carbon | 10-50μm | 10-50μm |
| Soldermask | on copper area(10-18μm),on via pad(5-8μm),on circuits
around the corner, ≥5μm ,just for one-time print & copper
thickness need lower than 48um | on copper area(10-18μm),on via pad(5-8μm),on circuits around
the corner, ≥5μm ,just for one-time print & copper thickness need
lower than 48um |
| Blue plastic | 0.20-0.80mm | 0.2-0.4mm |
| Hole | 0.1/0.15/0.2mm MAX thickness of mechanical hole | 0.8mm/1.6mm/2.5mm | 0.6mm/1.2mm/1.6mm |
| Min laser drilling size | 0.1mm | 0.1mm |
| Max laser drilling size | 0.15mm | 0.15mm |
| Finshed mechanical hole size | 0.10-6.2mm(corresponding drilling tool size0.15-6.3mm) | 0.15-6.2mm(corresponding drilling tool size0.2-6.3mm) |
| A,Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) | A,Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) |
| B,Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) | B,Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) |
| C,Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil | C,Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil |
| D,Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) | D,Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) |
| E,Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) | E,Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) |
| MAX aspect ratio for Hole plate | 20:1(hole diameter>8mil) | 15:1 |
| Max aspect ratio for laser via filling plating | 1:1 | 0.9:1 |
Max aspect ratio for mechanical depth-control
drilling board(Blind hole drilling
depth/blind hole size) | 1.3:1(hole diameter≤0.20mm),1.15:1(hole diameter≥0.25mm) | 0.8:1,hole diameter≥0.25mm |
| Min. depth of Mechanical depthcontrol(backdrill) | 0.2mm | 0.2mm |
| Min gap between hole wall and conductor (None blind and buried via PCB) | PIN-LAM:3.5mil(≤4L),4mil(5-8L),4.5mil(9-12L);5mil
(13-16L),6mil(≥17L) | 7mil(≤8L),9mil(10-14),10mil(>14L) |
Min gap between hole wall conductor
(Blind and buried via PCB) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) |
| | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
Min gab between hole wall
conductor
(Laser blind hole buried via
PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) |
Min space between laser holes
and
conductor | 5mil | 6mil |
Min space bwteen hole walls in
different
net | 10mil | 10mil |
Min space bwteen hole walls in
the same
net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) |
| Min space bwteen NPTH hole walls | 8mil | 8mil |
| Hole location tolerance | ±2mil | ±2mil |
| NPTH tolerance | ±2mil | ±2mil |
| Pressfit holes tolerance | ±2mil | ±2mil |
| Countersink depth tolerance | ±0.15mm | ±0.15mm |
| Countersink hole size tolerance | ±0.15mm | ±0.15mm |
| Pad(rin g) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via | 10mil(for 4mil laser via),11mil(for 5mil laser via |
Min Pad size for mechanical
drillings | 16mil(8mildiameter) | 16mil(8mildiameter) |
| Min BGA pad size | HASL:10mil,,Lead free min BGA (solder mask 16mil,etching 10mil), other surface technics are 7mi | HASL:10mil,Lead free min BGA (solder mask 16mil,etching 10mil), flash gold 7 mil,other surface technics are 10mil |
| Pad size tolerance(BGA) | +/-1.2mil(pad <12mil);+/-10%(pad≥12mil) | +/-1.5mil(pad<10mil);+/-15%(pad≥10mil) |
| | Inner layer | 1/2OZ:3/3mil | 1/2OZ: 3/3mil |
| 1OZ: 3/4mil | 1OZ: 3/4mil |
| 2OZ: 4/5mil | 2OZ: 4/5.5mil |
| 3OZ: 5/8mil | 3OZ: 5/8mil |
| 4OZ: 6/11mil | 4OZ: 6/11mil |
| 5OZ: 7/13.5mil | 5OZ: 7/14mil |
| 6OZ: 8/15mil | 6OZ: 8/16mil |
| 7OZ: 9/18mil | 7OZ: 9/19mil |
| 8OZ: 10/21mil | 8OZ: 10/22mil |
| 9OZ: 11/24mil | 9OZ: 11/25mil |
| 10OZ: 12/27mil | 10OZ: 12/28mil |
| Width/S pace | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| Outer layer | 1/3OZbase copper:3/3mil | 1/3OZbase copper:3.5/4mil |
| 1/2OZbase copper:3.5/3.5mil | 1/2OZbase copper:3.9/4.5mil |
| 1OZbase copper: 4.5/5mil | 1OZbase copper: 4.8/5.5mil |
| 1.43OZbase copper(positive):4.5/6 | 1.43OZbase copper(positive):4.5/7 |
| 1.43OZbase copper(negative):5/7 | 1.43OZbase copper(negative):5/8 |
| 2OZbase copper: 6/7mil | 2OZbase copper: 6/8mil |
| 3OZbase copper: 6/10mil | 3OZbase copper: 6/12mil |
| 4OZbase copper: 7.5/13mil | 4OZbase copper: 7.5/15mil |
| 5OZbase copper: 9/16mil | 5OZbase copper: 9/18mil |
| 6OZbase copper: 10/19mil | 6OZbase copper: 10/21mil |
| 7OZbase copper: 11/22mil | 7OZbase copper: 11/25mil |
| 8OZbase copper: 12/26mil | 8OZbase copper: 12/29mil |
| 9OZbase copper: 13/30mil | 9OZbase copper: 13/33mil |
| 10OZbase copper: 14/35mil | 10OZbase copper: 14/38mil |
| Width tolerance | ≤10mil:+/-1.0mil | ≤10mil:+/-20% |
| >10mil:+/-1.5mil | >10mil:+/-20% |
| Solderm ask | MAX drilling tool size for via filled
with Soldermask (double side) | 0.9mm | 0.9mm |
| Soldermask color | Green matte/glossy, Black matte/glossy, Blue matte/glossy,
Red, White,Yellow, | Green matte/glossy, Black matte/glossy, Blue matte/glossy, Red,
White,Yellow, |
| Silkscreen color | White, Yellow, Black | White, Yellow, Black |
MAX hole size for via filled
with Blue
glue aluminium | 5mm | 4.5mm |
Finish hole size for via filled
with resin | 0.1-1.0mm | 0.1-1.0mm |
Max aspect ratio for via filled
with resin
board | 12:1 | 8:1 |
| Min width of soldermask dam | base copper≤0.5OZ:4mil(best3.5mil,solder mask can't be
white/black),5.5mil(best is 5mil,black/white),8.0mil(on
copper area) | base copper≤0.5OZ:4mil(best3.5mil,solder mask can't be
white/black),5.5mil(best is 5mil,black/green),8.0mil(on copper
area) |
| base copper1OZ:4mil(green),5mil(solder mask can't be white/black),5.5mil(black/white),8.0mil(on copper area) | base copper1OZ:4mil(green),5mil(solder mask can't be white/black),5.5mil(black/white),8.0mil(on copper area) |
| base copper1.43OZ:4mil(green),5.5(can't be black/white), 6mil(black/white),8.0mil(on copper area) | base copper1.43OZ:4mil(green),5.5(solder mask can't be white/black),6mil(black/white),8.0mil(on copper area) |
| base copper2-4OZ:6mil,8mil(on copper area) | base copper2-4OZ:6mil,8mil(on copper area) |
| | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| Routing | Min space of the V-CUT does not reveal the copper ( Central Line of v-cut
to internal/external circuits,H means
board thickness) | H≤1.0mm:0.3mm(20°V-CUT),0.33mm(30°),0.37mm(45°); | H≤1.0mm:0.3mm(20°V-CUT),0.33mm(30°),0.37mm(45°); |
| 1.0<H≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°); | 1.0<H≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°); |
| 1.6<H≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°); | 1.6<H≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°); |
| 2.4 | 2.4 |
| V-CUT symmetrical tolerance | ±4mil | ±4mil |
| MAX V-CUT lines | 100 | 100 |
| V-CUT angle tolerance | ±5° | ±5° |
| V-CUT angle | 20,30,45° | 20,30,45° |
| Gold finger bevelling | 20,30,45° | 20,30,45° |
| Gold finger bevelling tolerance | ±5° | ±5° |
Min space of gold finger
chamfering
noninterference tab | 2.5mm | 7mm |
| Min gap between the side of gold finger and the shape edge line | 8mil | 10mil |
Depth tolerance of depth-control
groove
milling | ±0.10mm | ±0.10mm |
| Routing tolerance (edge to edge) | ±4mil | ±4mil |
Min tolerance for routing slot
(PTH) | width/length tolerance ±0.13mm | width/length tolerance ±0.13mm |
Min tolerance for routing slot
(NPTH) | width/length tolerance ±0.10mm | width/length tolerance ±0.10mm |
Min tolerance for drilling slot
(PTH) | slotwidth±0.075mm;slotLength/slotwidth<2:slotLength+/- 0.1mm;slotLength/slotwidth≥2:slotLength+/-0.075mm | slotwidth±0.075mm;slotLength/slotwidth<2:slotLength+/-0.1mm; slotLength/slotwidth≥2:slotLength+/-0.075mm |
Min tolerance for drilling slot
(NPTH) | slotwidth±0.05mm;slotLength/slotwidth<2:slotLength+/- 0.075mm;slotLength/slotwidth≥2:slotLength+/-0.05mm | slotwidth±0.05mm;slotLength/slotwidth<2:slotLength+/-0.075mm; slotLength/slotwidth≥2:slotLength+/-0.05mm |
| | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
| Local mixed pressur e | Min gap between mechanical hole
wall and conductor (Local mixed pressure area) | ≤10L:14mil;12L:15mil;>12L:18mil | ≤10L:14mil;12L:15mil;>12L:18mil |
Min gap between mechanical hole
wall and the junction of local mixed
pressure | ≤12L:12mil;>12L:15mil | ≤12L:12mil;>12L:15mil |
| | | Capabilities(Delivery area <5m2) | Capabilities(Delivery area ≥5m2) |
| Others | Max finished copper thickness to internal&external layer | inner Layer:10 OZ;outer layer:11 OZ | inner Layer:4 OZ;outer layer:5 OZ |
finished copper thickness to external
layer | 12,18μmbase copper:≥35.8(reference value:35.8-42.5);≥
40.4(reference value:40.4-48.5) | 12,18μmbase copper:≥35.8(reference value:35.8-42.5);≥40.4
(reference value:40.4-48.5) |
| 35,50,70μmbase copper:≥55.9;≥70;≥86.7 | 35,50,70μmbase copper:≥55.9;≥70;≥86.7 |
| 105,140μmbase copper:≥117.6;≥148.5 | 105,140μmbase copper:≥117.6;≥148.5 |
| Layer count | 1-40L | 1-20L |
| PCB thickness | 0.20-7.0mm(no solder mask);0.40-7.0mm(with solder mask); | 0.3-5.0(no solder mask),0.4-5.0(with solder mask); |
PCB thickness tolerance(Normal
) | thickness±10%(>1.0mm);±0.1mm(≤1.0mm); | thickness±10%(>1.0mm);±0.1mm(≤1.0mm); |
PCB thickness tolerance(Special
) | thickness±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm) | thickness±10%(≤2.0mm);±0.15mm(2.1-3.0mm) |
| Min finished PCB size | 10*10mm | 50*100mm |
| Max finished PCB size | 24.5*47inch | 24*47inch |
| ionic soil | ≤1ug/cm2 | ≤1ug/cm2 |
| Min bow&twist | 0.3%(This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry
layer Copper area within 10%, uniformity wiring , excluding the large area of copper and base material ,haven't plate and single panel, and the long side size≤ 21 inch) | 0.75% |
| Impedance tolerance | ±3Ω(<30Ω),±5%(≥60Ω),±7%(≥45Ω) | ±3Ω(<30Ω),±10%(≥30Ω); |
Laser blind via size with
filling plating | 4-5mil(priority4mil) | 4-5mil(priority 4mil) |
Max aspect ratio for laser via
filling plating | 1:1(Depth included copper thickness) | 1:1(Depth included copper thickness) |
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